Akrion Goldfinger Velocity

 
Single wafer cleaning system, 12" Vintage 2007

The velocity single wafer product line is focused on improving defectivity. 
This includes removal of particle and residue contamination from the wafer frontside, 
backside and edge. 
Defects are removed without physical damage to sensitive structures and without film etching. 

This is accomplished using advanced physical clean technologies – Goldfinger Megasonics, Jetstream Nano and Backside Megasonics. 
Watermark-free performance is available with Sahara dry. 

The Velocity is available in 4 or 6 chamber versions, each with stacked chambers to minimize footprint. The technology and platform are used for particle removal (post deposition, sensitive structures, backside and post post CMP) and post etch/ash (FEOL and BEOL) applications).

AMAT Centura High K​

 
Tool model: Centura 200mm
Process chamber is 100% complete and was fully operational prior to decommissioning.
Including: gas box, remote frame and all interfacing.
Condition "As Is".

AMAT Centura MXP Chamber​

 
200mm
ESC
Complete including turbo and RF-match.

Applied Baccini Soft Line​

 
Vintage 2009

Upgraded touchscreen, PC and software.
Machine used only in R&D in condition “as new”.

BTU PV 614​

 
PV 614 Solar Firing Furnace Vintage 2013
Heater type: IR lamp
Belt width: 36 cm. Conveyor speed: (cm/min) 56-560, 38 Load station 38 cm
Unload station: 38 cm

Number of heated zones: 6
Maximum temperature rating: 1000 °C
Operation temperature range: 200-900 °C
Forced Air Cooling Length: 229 cm atmosphere, CDA , 
typical (scfh, m3/hr.) 900, 25.2

Process exhaust, venturi assist 2
Electrical 400/230 VAC 112 AMP 81 KVA 50/60 Hz

Overall length 576 cm
Overall width 96,5 cm
Overall height 184 cm

Fogale Nanotech DEEPROBE 

 
Type: 300mm DEEPROBE 300-M, 2014.

Technology: Low Coherence IR interferometry for step high measurement

Applications: High A/R TSV depth measurement for 200 and 300mm wafer (via first & middle).

With benefits such as: non destructive technology, fast and easy to use, CCD camera for spot positioning  and pattern recognition, adjustable metrology spot size

TSV diameter > µm A:R up to 30 calibration 
maintenance free.

FSI Polaris 3500​

 
This 200 / 300mm track system is built on a proven 200mm platform
Together with this machine a spare Staubli/FSI RX 90B Robot.

Condition: "As is where is".

KLA Tencor INSPEX EAGLE (2 on hand)​

 
Condition: "As Is", wafer size: 150 mm capable 4” up to 8".

Equipment details: Wafer inspection system, chuck 6”, pre aligner 6”, cassette to cassette handling, 
(2) ports, ZEISS microscope. Including manuals.

KLA Tencor Surfscan 4500

 
Serial number: 1289-395

LAM 490 SN 1694

LAM 490 AutoEtcher

Polysilicon: 490
Wafer size: 6 inch
Upgraded TFT monitors, wafer detection
Incl maintenance console
Condition: As Is (No chiller, no pump but with ENI RF generator)

With features such as: single-wafer processing, fully automated microprocessor control, cassette-
to-cassette wafer processing, vacuum load locked, programmable variable electrode spacing, 
endpoint detection, configurable for 3-inch to 6-inch wafers and stand-alone or bulk-head mount configuration.

LAM 490 SN 1821 

 
LAM 490 Auto Etcher

Polysilicon: 490
Wafer size: 6 inch
Upgraded TFT monitors, wafer detection
Including maintenance console
Condition: “As Is” (no chiller, no pump but with ENI RF generator)

With features such as: single-wafer processing, fully automated microprocessor control, cassette-
to-cassette wafer processing, vacuum load locked, programmable variable electrode spacing, 
endpoint detection, configurable for 3-inch to 6-inch wafers and stand-alone or bulk-head mount configuration.

LAM 490 SN 9164​

 
Polysilicon: 490
Wafer size: 6 inch
Upgraded TFT monitors
Incl. maintenance console
Condition: "As Is" (no chiller, no pump but with ENI RF generator)

With features such as: single-wafer processing, fully automated microprocessor control,
cassette-to-cassette wafer processing, vacuum load locked, programmable variable electrode, spacing, endpoint detection, configurable for 3-inch to 6-inch wafers, stand-alone or bulk-head mount configuration.

PolyFlow Triple Power II S-417​

 
This PolyFlow system can be offered fully refurbished,
Including our own PLC system controller (Siemens S7).

Rudolph Sonus 7800 

 
Manufacturer: Rudolph Technologies, type: 300mm Sonus 7800, Date of manufacture: 2015.

Rudolph Technologies has introduced the SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, 
through silicon vias ( TSVs ).

Copper pillar bumps are a critical component of many advanced packaging technologies and 
TSVs provide a means for signals to pass through multiple vertically stacked chips in
three dimensional integrated circuits (3DIC). 

The SONUS Technology is non-contact and non- destructive, designed to provide faster, less costly measurements and greater sensitivity to smaller defects than existing alternatives such as X- ray tomography and acoustic microscopy.

SEMIX TAZMO SOG Track​

 
Basic configuration: 150 mm, 2 load and 2 unload stations, 1 coater,
2 SOG dispense lines and 3 baking plates.

Options: Refurbishment, new CE certification, installation and warranty.

SSEC / Veeco ML 3300

 
Single wafer cleaning system, 8",  Vintage 2005.

WaferStorm Wet Processing Platform.

The WaferStorm platform is the industry choice for a number of critical solvent-based processes in the advanced packaging, MEMs, RF, Data Storage and Photonics markets. 

The ML 3300 system is well suited for R&D and pilot environments.

TEL Tactras RLSA Etch Chamber

Tactras™ RLSA™ provides an innovative, new plasma technology that TEL has been optimizing for years.
Microwave technology provides high selectivity and excellent etch-profile control with low electron temperature. of the radical-rich process by diffusion plasma. 

In addition, the output microwave stability, high repeatability, and process operation range has been improved with microwave broadband technology which enables precise control of the radical/ion ratio for high profile controllability. 

Tactras™ RLSA™ has a high market share for a critical
application in leading-edge logic devices. 

RLSA Chamber information: for wafer with Dual He Cooling, NiHON Koshuha Microwave Generator,
Model: MKS 050B04C-OSC-V
Turbo Pump: SHIMADZU / Model is FT2301D Generator Details:
Top: MKS-050B04 PS-V 
Bottom: Daihen RGA-20C
Including gas box configuration: N2, TSA, Ar, H2, NF3, SiH4